BioSiC®
Biomorphic silicon carbide (bioSiC®) is an SiC-based advanced ceramic material, fabricated through a cost effective and environment friendly process that uses cellulose as its starting point.
BioSiC® shows excellent thermo-mechanical performance, chemical and structural stability, in a wide interval of temperatures. It’s possible to tailor the thermal and electrical properties of these materials to a wide range of values to satisfy device requirements.
Mechanical Properties at room temperature :
| Density | 1.1 a 2.6 g.cm-3 |
| Young Modulus | 25 a 250 GPa |
| Compressive strength | 1500 MPa |
| Bending strength | 430 MPa |
| Toughness | 3 MPa.m1/2 |
| Dilatation coefficient | 3.5. 10-6K-1 |
Thermal Properties:
- Anisotropic Thermal Conductivity (variation up to 30%).
- Tailorable values in a wide range (50-120 W/mK).
Electrical Properties:
- Anisotropic Electrical Resistivity (ratio over 10).
- Tailorable values in a wide range (0.02-20 Ωּcm).
- Adjustable dependence with temperature.



